Digital Lead-Free Soldering Station Solder Gun Hot Air Iron

Digital Lead-Free Soldering Station Solder Gun Hot Air Iron Review

Digital Lead-Free Soldering Station Solder Gun Hot Air Iron Feature

• Automatically stop rotation when the temperature is less than 70°C
• ESD design of soldering iron to protect sensitive components
• Plastic holder for placing the hot air gun
• Suitable for SOIC, CHIP, QFP, PLCC, BGA and temperature-sensitive components
• PID technology to enhance temperature stability,, quick warming-up

Tools as Free Gift: 4 Nozzles (Ø5mm, Ø7mm, Ø10mm, Ø12mm, )for versatile applications 1 DC Probe Cable for testing conveniently 1 IC Extractor for ease using an extraction operation 1 Sponge to wipe the soldering tips at times 1 De soldering Wick CP-2015F for perfect joint 11pcs of Iron tips (900M-T-B, 3C, 2.4D, 1.2D, K, 3.2D, 2C, 1.6D, 4C,Two 900M-T-I) Features: 3 in 1 (Soldering Station, Hot Air Rework Station and DC Power Supply) Extremely low noise and space efficient design Two LED digital displays to show precision temperature One LED display to show the mobile RF signal and testing voltage PID technology to enhance temperature stability,, quick warming-up PID microcomputer control, over-temperature, short circuit, open circuit, overload protections. Adjust the airflow and temperature control rotation easily Intelligence self-detection function features safe personal operation Automatically stop rotation when the temperature is less than 70°C Handle with sensor switch features access operating mode when picks up or standby mode when lays down Automatic cooling function for effectively prolonging the heater's life and protecting the hot air gun ESD design of soldering iron to protect sensitive components International standard heater for convenient use and exchange High-quality resistance for durable use Plastic holder for placing the hot air gun Metal Stand for keeping the iron from flammable materials Excellent for laboratories, universities and mobile computer repair and RF signal test, etc. Suitable for SOIC, CHIP, QFP, PLCC, BGA and temperature-sensitive components Fits for heating shrink, drying, lacquer removal, viscidity removal, ice-out, pre-heating and glue soldering Voltage: 110V/AC Storage Environment: -20~80°C CE approved